系统架构
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20槽底板
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体积
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331 mm (L) x 84 mm (W) (13.03" x 3.30")
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槽
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1 x PICMG 1.3 (SHB slot) 16 x PCI-X 64bit/66Mhz
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I/O 接口
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2 x SATA 1 x IPMI 1 x SMBUS 1 x Wake-up 6 x 3-pins FAN 1 x 6 pin JST NEXCOM Defi ned front I/O connector for Power LED Connector/ Power Switch/ Reset Button connector
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电源输入
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1 x 24-pins power connector 2 x 8-pins 12V AUX power connector 2 x 6-pins 3.3V power connector for PCI-X add-on 1 x Terminal Block (Reserved)
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电源输出
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1 x 4-pins power connector for FAN
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环境
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操作温度: 0°C ~ 60°C 存储温度: -20°C ~ 80°C 相对湿度:操作 10%~90%, 无凝露, 无操作 5%~95%, 无凝露
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认证
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CE approval FCC Class A
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